半導體

  1. 半導體
Through Glass Via Inspection

Through Glass Via Inspection

TGV 測定装置
Through Glass Via Inspection
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Through Glass Via Inspection
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Through Glass Via Inspection
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  • Through Glass Via Inspection
  • Through Glass Via Inspection
  • Through Glass Via Inspection
詳細介紹
TGV 測定装置
  • 無需翻面可同時量測Top、Bottom、Waist 孔徑資訊 !
  • 玻璃最大尺寸 510mm x 515mm 時間 15 鐘內完成量測!
  • DXF 比對快速建模量測比對!
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